Equipment Engineer, Wafer Dicing/wafer Sawing

Malaysia, Malaysia

Job Description


Malaysia

Job details Posted 19 June 2023 SalaryRM6000 - RM10000 per month LocationSelangor Job type Discipline Reference266216_1687162477

Equipment Engineer, Wafer Dicing/Wafer Sawing

Job description

This global semiconductor company in Klang Valley is looking for an Equipment Engineer who is experienced in Wafer Dicing/ Wafer Sawing.

Key Responsibilities:

  • Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products
  • Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment startup and commissioning activities
  • Keeping current on equipment manufacturers\' technical notices, upgrades and safety issues
  • Studying equipment performance and reliability
  • Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
  • Providing technical support to the manufacturing and process engineering organizations
  • Defining and writing preventative maintenance schedules
Skills & Experience Required:
  • Bachelor Degree in Mechanical Engineering or any relevant engineering background
  • Minimum 4 years of Wafer Dicing and die bond equipment experiences or relevant experiences working in a semiconductor manufacturing environment and
  • Knowledge in laser wafer dicing and die bond will be added advantage
  • Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
  • Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
  • Strong verbal and written communication skills
  • Demonstrated strong analytical, critical thinking and problem-solving skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Ability to take the initiative and drive for results
  • Strong time management skills that enable on-time project delivery
  • Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
  • Demonstrated ability to build strong, influential relationships
  • Strong knowledge in ASM, ADAT or relevant equipment series, epoxy cure process and intermediate level understanding on upstream and downstream processes
  • Good experience/ knowledge in soft skill such as LABVIEW, ARDUINO and etc
To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

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Equipment Engineer, Wafer Dicing/Wafer Sawing

Selangor Posted about 18 hours ago

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JTK Number: JTKSM 995

Company Registration Number: 201301019088 (1048918-T)

Malaysia

Ambition Group Malaysia, BO1-B-10, Boutique Offices 1 Menara 2, 3, Jalan Bangsar, KL Eco City

Ambition

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Job Detail

  • Job Id
    JD959464
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    10000 per month
  • Employment Status
    Permanent
  • Job Location
    Malaysia, Malaysia
  • Education
    Not mentioned