Job Description

Malaysia

Job details Posted 18 July 2023 SalaryRM6000 - RM10000 per month LocationSelangor Job type Discipline Reference266216_1689679191

Equipment Engineer, Wafer Dicing/Wafer Sawing

Job description

This global semiconductor company in Klang Valley is looking for an Equipment Engineer who is experienced in Wafer Dicing/ Wafer Sawing.

Key Responsibilities:

• Evaluating, selecting, and ordering equipment that is most appropriate and cost effective for the manufacture of company products
• Overseeing the installation, modification, upgrade and maintenance of manufacturing equipment startup and commissioning activities
• Keeping current on equipment manufacturers\' technical notices, upgrades and safety issues
• Studying equipment performance and reliability
• Establishing programs and solutions for increasing uptime and for equipment problems that affect the manufacturing process
• Providing technical support to the manufacturing and process engineering organizations
• Defining and writing preventative maintenance schedules

Skills & Experience Required:

• Bachelor Degree in Mechanical Engineering or any relevant engineering background
• Minimum 4 years of Wafer Dicing and die bond equipment experiences or relevant experiences working in a semiconductor manufacturing environment and
• Knowledge in laser wafer dicing and die bond will be added advantage
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationships
• Strong knowledge in ASM, ADAT or relevant equipment series, epoxy cure process and intermediate level understanding on upstream and downstream processes
• Good experience/ knowledge in soft skill such as LABVIEW, ARDUINO and etc

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)

If this job isn\'t quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.

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Equipment Engineer, Wafer Dicing/Wafer Sawing

Selangor Posted about 13 hours ago

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JTK Number: JTKSM 995

Company Registration Number: 201301019088 (1048918-T)

Malaysia

Ambition Group Malaysia, BO1-B-10, Boutique Offices 1 Menara 2, 3, Jalan Bangsar, KL Eco City

Ambition