Intern, Wire Bond Assembly Engineering

Teluk Panglima Garang, M10, MY, Malaysia

Job Description





Work on OEE Improvement project for Wire bond process. Support Equipment engineer in MC Performance/Qualification, Work/Time Study, Capacity analysis & planning, Layout planning & execution Gain technical knowledge on the identified tool and work with engineers, operators, and technicians. Process Optimization: Support Process engineer in performing DOE, Wire bond Validation, Wire bond Assessment, Data Collection, Analysis and Report Compilation.

Qualifications





Education Background: Final year of a Degree in Engineering - Mechanical / Electrical / Electronics / Mechatronics / Semiconductor Technology or equivalent. Technical Skills: Proficient in Microsoft Excel and PowerPoint. Data analytics and reporting.

Additional Information





Renesas is an embedded semiconductor solution provider driven by its Purpose '

To Make Our Lives Easier

.' As the industry's leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.



With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, '

To Make Our Lives Easier

.'



At Renesas, you can:

Launch and advance your career

in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.

Make a real impact

by developing innovative products and solutions to meet our global customers' evolving needs and help make people's lives easier, safe and secure.

Maximize your performance and wellbeing

in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?


Join Renesas. Let's

Shape the Future

together.


Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our

Diversity & Inclusion Statement

.



Job title


Intern, Wire Bond Assembly Engineering

Department

Manufacturing

Location

Telok Panglima Garang

Remote

No

Requisition ID

20018407_2024-12-22

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Job Detail

  • Job Id
    JD1122099
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Internship
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Teluk Panglima Garang, M10, MY, Malaysia
  • Education
    Not mentioned