Job Description

Key Responsibilities1. Die Attach / Wire Bond

Develop and optimize die attach and wire bonding processes to achieve high yield, quality, and reliability. Troubleshoot bonding-related issues and perform detailed root cause analysis. Support New Product Introduction (NPI), process qualification runs, and engineering builds. Monitor, control, and improve key process parameters and production performance.

2. Trim & Form / Singulation

Develop, optimize, and sustain end-to-end trim, form, and singulation processes across various package types. Ensure dimensional accuracy, coplanarity, and mechanical reliability of all outputs. Troubleshoot manufacturing defects such as bent leads, burrs, cracks, incomplete cuts, and misalignment. Lead NPI builds, process qualifications, tooling validations, and parameter optimization for new product ramp-up. Enhance tooling performance, punch/blade selection, and machine capability to improve throughput and cost efficiency. Strengthen control over key KPIs including mechanical yield, dimensional compliance, edge quality, and scrap reduction.

3. Molding / Laser Marking

Develop, sustain, and improve molding and laser marking processes to ensure stable quality and production efficiency. Optimize molding parameters to enhance package integrity and address issues such as voids, flash, delamination, and dimensional defects. Ensure marking alignment, clarity, and readability meet customer requirements; troubleshoot fading, smudging, and misalignment. Support NPI activities, setup, process validation, and documentation. Monitor equipment conditions and drive improvements in accuracy, cycle time, and yield.

Job Requirements

Bachelor's Degree or higher in

Electrical, Electronics, Mechanical Engineering

, or related fields. Minimum

3-4 years

of hands-on experience in process engineering, preferably within the

semiconductor industry

. Strong knowledge of

SPC, DOE, FMEA, 8D methodology, Lean Manufacturing

, and structured problem-solving techniques. Mandarin language proficiency is an added advantage due to collaboration with China-based projects. Hands-on, proactive, and able to work effectively in a fast-paced manufacturing environment.
Job Type: Full-time

Pay: RM3,000.00 - RM5,000.00 per month

Experience:

industrial experience in process engineering: 3 years (Preferred)
Language:

Mandarin (Preferred)
Work Location: In person