Responsible for Quality, Yield, Cost and Productivity improvement activities related to Pre-Assembly and Die Attach process in RF Assembly
Partner with manufacturing and equipment team to support delivery, work on daily production line issues, drive quality and operational excellence
Responsible for process yield improvements and LOH reduction through systemic problem solving and identifying solutions to baseline issues
Collaborate with API for Pre-Assembly and die attach process and material optimization
Partner with supplier, vendor, procurement to work on productivity and cost improvement projects for the operation
Support NTI/NPI qualification, apply lesson learnt and ensure smooth transition to high-volume manufacturing
Responsible for FMEA, Control Plan, OCAP and SWE as documentation owner and to drive enhancement and compliance
Work on strategic industrialization plan, automation and quality firewall implementation
Collaborate with cross functional team to improve manufacturing robustness and process stability
Support internal and external audit, drive compliance to requirements
Profile
Bachelor\xe2\x80\x99s Degree in Engineering Discipline (Material Science/Electrical/Mechanical or equivalent)
3-6 years of working experience in Semiconductor industry with hands-on experience in Die Sort, Stealth Dicing, SMT, Die Attach, AOI is an added advantage
Knowledge on SPC, Process Control, Statistics and DMAC problem-solving skills would be preferable
Good knowledge in material science especially metallurgy
Technically competent, data driven and hands-on with strong analytical thinking and good in problem solving
Has the desire to learn, take up new challenges, consistently challenge status quo and eager to strive for success
Strong interpersonal skills, a good team player with ability to work independently and resourceful
Able to multi-tasks, work under pressure and tight dateline and comfortable working in a fast-paced environment