Job Description

About the Role
The Plating Engineer leads the sustaining and continuous improvement of plating processes and equipment performance across various semiconductor package types. This role ensures process stability, capability, and quality through proactive monitoring, root cause analysis, and cross-functional collaboration. The engineer will also play a key role in driving yield improvement, cost reduction, and productivity enhancement initiatives.
What You Will DoLead and manage plating process and equipment performance improvement for multiple package types. Conduct routine process evaluations to ensure compliance with capability and performance standards. Identify and analyze process variations and deviations, and implement corrective actions to improve yield, process capability, and lot-on-hold management. Perform lot-on-hold (LOH) disposition and coordinate with the treatment team to accelerate lot movement and minimize production delays. Collaborate with equipment engineering to validate new product designs and ensure readiness for high-volume manufacturing (HVM). Maintain and update technical documentation such as control plans, process specifications, SOPs, technical reports, and FMEAs. Strategically plan technician headcount and shift coverage to support 24/7 operations while ensuring clear task delegation and communication. Mentor and develop technicians to strengthen technical capability and engineering mindset, including KPI setting and performance evaluation. Partner with R&D, NPI, product design, and reliability teams to align plating equipment capabilities with process and package requirements. Troubleshoot and resolve plating-related process and quality issues using structured problem-solving approaches. Support the smooth transfer of new technologies, chemicals, and equipment into mass production. Contribute to the process roadmap for advanced packaging technologies, thin form factors, and emerging device architectures. Drive continuous improvement projects related to MVA, yield enhancement, and UPH optimization. Coordinate with suppliers and vendors for jig and fixture procurement, ensuring timely delivery of parts and equipment. Maintain high EHS standards and promote 5S compliance within the plating area.

What You Will NeedBachelor's degree in an engineering discipline; Chemical Engineering background is highly preferred. Minimum 5 years of semiconductor industry experience, with at least 3 years in plating processes. Hands-on experience with semiconductor plating equipment and process control systems. Strong analytical skills with proficiency in JMP, Minitab, or other statistical tools. Good understanding of chemical interactions with metal alloys, epoxy, and other semiconductor materials. Strong documentation, communication, and collaboration skills. Committed to strict compliance with Environmental, Health & Safety (EHS) standards and chemical handling protocols. Able to perform in a fast-paced, high-volume manufacturing environment with cross-functional engagement.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.