Staff Engineer, Packaging Engineering

Perai, Pulau Pinang, Malaysia

Job Description


Company Description

At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible.

At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we\xe2\x80\x99ve been doing just that. Our technology helped people put a man on the moon.

We are a key partner to some of the largest and highest growth organizations in the world. From energizing the most competitive gaming platforms, to enabling systems to make cities safer and cars smarter and more connected, to powering the data centers behind many of the world\xe2\x80\x99s biggest companies and public cloud, Western Digital is fueling a brighter, smarter future.

Binge-watch any shows, use social media or shop online lately? You\xe2\x80\x99ll find Western Digital supporting the storage infrastructure behind many of these platforms. And, that flash memory card that captures and preserves your most precious moments? That\xe2\x80\x99s us, too.

We offer an expansive portfolio of technologies, storage devices and platforms for business and consumers alike. Our data-centric solutions are comprised of the Western Digital\xc2\xae, G-Technology\xe2\x84\xa2, SanDisk\xc2\xae and WD\xc2\xae brands.

Today\xe2\x80\x99s exceptional challenges require your unique skills. It\xe2\x80\x99s You & Western Digital. Together, we\xe2\x80\x99re the next BIG thing in data.



Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module Engineering) supporting New Product Introduction/Qualification from Development to High volume manufacturing.

  • New Die Prep (Wafer Backgrinding, Sawing, Laser Dicing, Stealth Laser Dicing) Process Development for new wafer technology, next generation products, new material qualifications and new process qualifications
  • Setup new recipe for Die Prep processes (Back-grinding, mounting, laser groove, mechanical dicing), perform complete window study, DOEs, corner limits
  • Golden recipe setup for new package qualification
  • Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets
  • Process transfer from Development to New product Introduction team & from site to site
  • Work closely with Cross site\xe2\x80\x99s Product development & design team to understand the Package Design Rules & Requirements
  • Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology
Qualifications
  • Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, & etc)
  • Min 2-7 years of working experience in Semiconductor Process development
  • Expertise/Experience in Disco machines, Die Prep, an added advantage
  • Knowledge in Semiconductor assembly processes
  • Familiarize with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Minitab, JMP
  • Knowledge of Design Of Experiment (DOE)
  • Self- motivated, possess initiatives and ability to lead and work independently
  • Good project planning, strong sense of quality and urgency
  • Team leads with good communication and interpersonal skills
  • Able to work long hours in production line
Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital\xe2\x80\x99s behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to compliance@wdc.com.

Western Digital

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Job Detail

  • Job Id
    JD960796
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    Perai, Pulau Pinang, Malaysia
  • Education
    Not mentioned