Job Description

MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer.Key Responsibilities:

• Research and Development: Conduct research to develop and improve semiconductor components, with a particular emphasis on Aluminum Wedge bonding techniques.
• Product Development: Collaborate with cross-functional teams to develop new semiconductor products and optimize existing ones. This includes designing, prototyping, and testing.
• Material Selection: Select appropriate materials for semiconductor components, considering factors such as performance, cost, and availability.
• Process Optimization: Continuously improve semiconductor manufacturing processes, ensuring efficiency and quality standards are met.
• Data Analysis: Collect and analyze experimental data to identify trends, troubleshoot issues, and make data-driven decisions.
• Innovation: Stay updated on industry trends, emerging technologies, and advancements in semiconductor manufacturing to propose and implement innovative solutions.
• Quality Assurance: Ensure all developed products meet high-quality standards and compliance with industry regulations.
• Documentation: Maintain accurate and comprehensive documentation of all research, development, and testing activities.
• Collaboration: Work closely with colleagues in R&D, engineering, and other departments to foster a collaborative and innovative environment.
• Project Management: Manage multiple projects simultaneously, set priorities, and meet deadlines.

Skills & Experience Required:

• Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Materials Science, or a related field.
• Strong knowledge and experience with semiconductor manufacturing processes, with a focus on Aluminum Wedge bonding.
• Proven expertise in research and development in the semiconductor industry.
• Excellent problem-solving skills and a creative, innovative mindset.
• Proficiency in data analysis tools and statistical analysis.
• Strong communication and collaboration skills to work effectively in a team environment.
• Detail-oriented and highly organized with the ability to manage multiple projects.
• Familiarity with industry regulations and quality standards.
• Project management skills are a plus.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobWire Bond Development EngineerSelangor Posted about 18 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

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