Job Description

MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276832_1732265868Wire Bond Development EngineerJob descriptionOur client is a semiconductor MNC in Central Malaysia. They are seeking to hire a Wire Bond Research & Development Engineer.Key Responsibilities:

• Aluminium (Al) Wire Bonding Process Development:

• Understand power module design and suggest improvements related to Al wire bonding.
• Expertise in DFMEA, updating DFMEA, and generating PFMEA linked with it.
• Knowledge of Al wire materials and identifying key process variables (KPIV) from failure modes.
• Define KPOV and analyze process capabilities.
• Prepare technical reports on FMEA failure modes using statistical tools like JMP and Minitab.
• Collaborate with technical leaders to generate deliverables like Control Plans and D/PMEAs.
• Technical Leadership in Al Wire Bonding:

• Lead new process and equipment initiatives with technical leaders and suppliers.
• Oversee P.O specification generation and buy-off processes.
• Develop COO for new processes and equipment.
• Benchmark new and improved processes/equipment not currently in use.
• Create a process technology roadmap and define new design rules based on characterization.
• Understand customer requirements and environmental, health, and safety (EHS) standards.
• Provide systematic solutions and improvement plans for process defects.
• Support quality issues in production and collaborate with the manufacturing team.
• COE Line Equipment Maintenance and Management:

• Hands-on experience in setting up Al wire bonding equipment and tooling.
• Design tooling and jigs in collaboration with designers and suppliers.
• Ensure timely equipment/tooling/jig readiness.
• Lead technicians/operators to ensure correct task execution.
• Share technical issues, results, and improvement plans with technical leaders.

Skills & Experience Required:

• Experience: Minimum 10 years, particularly in Al wire bonding (Al wedge, Au/Cu ball bonding), with a background in design or equipment engineering being a plus.
• Package Expertise: Familiar with transfer molded power modules, including Intelligent Power Modules, Dual Side Cooling Modules, and Power Discrete.
• Nationality: Local candidates preferred.
• Education: Bachelor's or Master's degree.
• Skills: Proficient in English, statistical software (JMP, Minitab), Auto-CAD, and MS Office (especially PowerPoint).
• Personal Traits: Self-motivated, independent, communicative, open-minded, and willing to take risks and manage challenges.

To apply, please click "APPLY NOW" or email Shan Li at . Data provided is for recruitment purposes only.Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)If this job isn't quite right for you, but you know someone who would be great at this role, why not take advantage of our referral scheme? We offer MYR500 in shopping vouchers for every referred candidate who we place in a role. Terms & Conditions Apply.Sign up for job alertsIf you are a human, ignore this field Create alertYou agree to ourShare this jobWire Bond Development EngineerMalaysia Posted about 18 hours agoQuick LinksConnectWe are committed to Building Better Futures for the organisations we work for, the professionals we help, and our own employees.Agensi Pekerjaan Ambition Group Malaysia Sdn. Bhd.JTK Number: JTKSM 995Company Registration Number: 201301019088 (1048918-T)MalaysiaSuite 8.03 & 8.05, Level 8, The Gardens North Tower, Mid Valley City, Lingkaran Syed Putra

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