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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Capillary Underfill (CUF) Process Technology Development Module Engineer Intel Corporation Kulim, M02, MY Jan 24, 2026Job Details: ================ Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment…
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Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that improve the…
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Staff Engineer, Technology Development (Silicon Failure Analysis) SanDisk Batu Kawan, M07, MY Jan 21, 2026Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) AT&S Kulim, M02, MY Jan 20, 2026
Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Process Development Staff Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Jan 18, 2026Process Development Staff Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop Die Attach &…
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Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that improve the…
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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) AT&S Kulim, M02, MY Jan 16, 2026
Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that improve the…
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Intel Corporation Kulim, M02, MY Jan 11, 2026
Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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Job Description In your new role you will: Develop the next generation of SiC technologies Develop new voltages classes and broadening the…
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You have a passion for technology and innovation to shape the future of power electronics - listen up! We are looking for…
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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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Job Description In your new role you will: Package Design and Development: Design and develop power module and power package technologies, ensuring…
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Casting/Dispensing Process Development Staff Engineer Kulim, Kedah, Malaysia - OSRAM OS Penang Your tasks As a process expert & responsible for developing…
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Job Details: ================ Job Description: The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced…
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Capillary Underfill (CUF) Process Technology Development Module Engineer Intel Kulim, Kedah Dec 25, 2025Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and…
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Staff Engineer, Technology Development (Silicon Failure Analysis) SanDisk Batu Kawan, Pulau Pinang Dec 23, 2025
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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