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CMM Technician Development Malaysian Die-casting Industries Sdn. Bhd. Shah Alam, Selangor Feb 12, 2026
Malaysian Die casting Industries Sdn. Bhd. Hiring! Full Time CMM Technician Development in Selangor, Earn up to MYR 3,000 Ricebowl e.target.src =…
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Die Bond / Wire Bond Process Development Senior Staff Engineer ams OSRAM Bayan Lepas, M07, MY Jan 19, 2026Die Bond / Wire Bond Process Development Senior Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop…
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Primary Duties & Responsibilities Responsible for sustaining & improving the wafer backend/coating process Execute process engineering tasks & support production to meet…
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JAWATAN KOSONG - PART TIME (Kilang Elektronik) Kontrak 3 bulan Lokasi Iskandar Puteri Gaji Harian RM135 (8 jam kerja) Jawatan Electrical Assembler…
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Process Development Staff Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Jan 18, 2026
Process Development Staff Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop Die Attach &…
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Primary Duties & Responsibilities Responsible for DR8 Gen1.5 Support DR8 Gen1.5 Die attach process. To assist the process engineer in achieving assembly…
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About the Role As a Senior Process Engineer (Die Attach), you will be responsible for developing, improving, and sustaining die attach processes…
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Description: Ready to join a global supplier of precision engineered solutions in manufacturing and testing across markets such as automotive, defense/aerospace, industrial,…
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Job Description : Inspect and assess dies for wear, damage, or defects. Perform necessary corrections, adjustments, and repairs to maintain die functionality.…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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Position : Die Bond Techinician Location : Ampang KL. Salary : up to 3800++ Status : Permanent Provide : Medical, Kwsp, Socso,…
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About the Role As a Senior Engineer specializing in Die Attach and Clip Attach (DACA) processes, you will lead the development, optimization,…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Jan 14, 2026
About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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PERSOL Malaysia Hiring! Full Time Assembler in Johor, Earn up to MYR 2,500 Ricebowl e.target.src = 'https://files.ajobthing.com/assets/premium job/premium default banner.png'" class="object contain…
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Company Background:? Our client is a global leader in the design and manufacturing of automotive seat motors, dedicated to enhancing vehicle comfort.…
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Intel Corporation Kulim, M02, MY Jan 11, 2026Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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RESPONSIBILITIES: Repair and maintain die performance, include die trial to reduce to minima as possible. Settle overdue order. Make sure die is…
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Job Details: ================ Job Description: The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced…
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JOB VACANCIES Position : Die Bond Techinician Salary : RM 2000 up to 3500 Status : Permanent Provide : Medical, Kwsp, Socso,…
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Equipment Staff Engineer (Die Attach) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang Your tasks Performs design, development, modification and testing and…
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