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Die Bond / Wire Bond Process Development Senior Staff Engineer ams OSRAM Bayan Lepas, M07, MY May 24, 2026Die Bond / Wire Bond Process Development Senior Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop…
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Process Development Staff Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY May 23, 2026
Process Development Staff Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop Die Attach &…
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Equipment Staff Engineer (Die Attach) 1 Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Performs design, development, modification and…
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JAWATAN KOSONG - PART TIME (Kilang Elektronik) Kontrak 3 bulan Lokasi Iskandar Puteri Gaji Harian RM135 (8 jam kerja) Jawatan Electrical Assembler…
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Die Attach Process Development Senior Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop or optimize Die…
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JOB RESPONSIBILITIES: Responsible for sustaining & improving the Die Attach & Wire Bond Process Overall knowledge on electronics manufacturing and must be…
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Primary Duties & Responsibilities Responsible for DR8 Gen1.5 Support DR8 Gen1.5 Die attach process. To assist the process engineer in achieving assembly…
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Description: Ready to join a global supplier of precision engineered solutions in manufacturing and testing across markets such as automotive, defense/aerospace, industrial,…
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Job Description : Inspect and assess dies for wear, damage, or defects. Perform necessary corrections, adjustments, and repairs to maintain die functionality.…
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Position : Die Bond Techinician Location : Ampang KL. Salary : up to 3800++ Status : Permanent Provide : Medical, Kwsp, Socso,…
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Primary Duties & Responsibilities Responsible for sustaining & improving the wafer backend/coating process Execute process engineering tasks & support production to meet…
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About the Role As a Senior Process Engineer (Die Attach), you will be responsible for developing, improving, and sustaining die attach processes…
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PERSOL Malaysia Hiring! Full Time Assembler in Johor, Earn up to MYR 2,500 Ricebowl e.target.src = 'https://files.ajobthing.com/assets/premium job/premium default banner.png'" class="object contain…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY May 15, 2026
About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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About the Role As a Senior Engineer specializing in Die Attach and Clip Attach (DACA) processes, you will lead the development, optimization,…
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Intel Corporation Kulim, M02, MY May 12, 2026Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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RESPONSIBILITIES: Repair and maintain die performance, include die trial to reduce to minima as possible. Settle overdue order. Make sure die is…
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Job Details: ================ Job Description: The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced…
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Company Background:? Our client is a global leader in the design and manufacturing of automotive seat motors, dedicated to enhancing vehicle comfort.…
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