\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ \ Job Description In your new role you will: Implement Process development activities (Process parameters scouting, optimization, verification and Process Freeze)…
\ \ Location: Melaka Job ID: HRC0734182Job description In your new role you will: Implement Process development activities (Process parameters scouting, optimization,…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Location: Melaka Job ID: HRC0747472Job description In your new role you will: Yield improvement activities for Die Attach process Sustain…
\ \ Job Description In your new role you will: Quality improvement activities on DDM investigation, disposition and improvement Yield improvement activities…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ \ Location: Melaka Job ID: HRC0728671Job description In your new role you will: Quality improvement activities on DDM investigation, disposition and…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
Bertanggungjawab sebagai ketua jabatan Casting, Secondary, Tooling, Maintenance Memastikan setiap jabatan berfungsi dengan baik dan produk dikeluarkan menepati kualiti ditetapkan \ Our…
\ \ Equipment Engineering Technician/Sr Technician/Associate Engineer (Die Attach)\ Bayan Lepas, Malaysia \\xe2\\x80\\x93 OSRAM OS Penang\ \ \ What we expect\ \…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1732267956Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
Design the press tools, according to the inputs. Participate in design review with cross functional team change the design according to the…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference266336_1687167202 Process Development Manager, Die Bond Job description This…