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Staff Hardware Development Engineer (Package Design) Advanced Micro Devices Pulau Pinang Mar 26, 2026Job Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation…
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Staff Engineer, Technology Development (Silicon Failure Analysis) SanDisk Batu Kawan, M07, MY Mar 24, 2026Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Principal Engineer, Chip Development Nitride LEDs Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation of AlInGaN…
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Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed. Define the…
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Principal Engineer, Chip Development Nitride LEDs Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation of AlInGaN…
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Product Design & Integration Principal Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Lead package design meeting customer…
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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) AT&S Kulim, M02, MY Mar 21, 2026Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Principal Engineer, Product Development Engineering Module SanDisk Batu Kawan, Pulau Pinang Mar 21, 2026
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Senior Principal Engineer, Chip Design & Device Development Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation…
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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) AT&S Kulim, M02, MY Mar 14, 2026
Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved. Your…
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Job Description In your new role you will: Package Design and Development: Design and develop power module and power package technologies, ensuring…
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Senior Staff Engineer Package Technology Development Infineon Technologies Ipoh, M08, MY Mar 09, 2026
To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved. Your…
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This role involves defining and developing optimal test solutions and handling capabilities for new packages/products. It includes executing buyoff, upgrades, and releases…
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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Capillary Underfill (CUF) Process Technology Development Module Engineer Intel Corporation Kulim, M02, MY Jan 24, 2026Job Details: ================ Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment…
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