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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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Staff Hardware Development Engineer (Package Design) Advanced Micro Devices Pulau Pinang Jan 26, 2026Job Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation…
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Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Generate conceptual package outline and internal construction drawings, finalize and document the drawings and update the package drawings as needed. Define the…
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Capillary Underfill (CUF) Process Technology Development Module Engineer Intel Corporation Kulim, M02, MY Jan 24, 2026Job Details: ================ Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment…
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Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Principal Engineer, Product Development Engineering Module SanDisk Batu Kawan, Pulau Pinang Jan 22, 2026
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Staff Engineer, Technology Development (Silicon Failure Analysis) SanDisk Batu Kawan, M07, MY Jan 21, 2026
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Product Design & Integration Principal Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Lead package design meeting customer…
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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) AT&S Kulim, M02, MY Jan 20, 2026
Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Principal Engineer, Chip Development Nitride LEDs Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation of AlInGaN…
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Principal Engineer, Chip Development Nitride LEDs Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation of AlInGaN…
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Senior Principal Engineer, Chip Design & Device Development Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation…
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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) AT&S Kulim, M02, MY Jan 16, 2026
Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Senior Staff Engineer Package Technology Development Infineon Technologies Ipoh, M08, MY Jan 10, 2026
To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved. Your…
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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved. Your…
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Job Description In your new role you will: Package Design and Development: Design and develop power module and power package technologies, ensuring…
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This role involves defining and developing optimal test solutions and handling capabilities for new packages/products. It includes executing buyoff, upgrades, and releases…
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