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Job Details: ================ Job Description: The Technical Equipment Group (TEG) is offering the opportunity to continue growing your career within Intel and…
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About the role Responsible for ensuring high performance, reliability, and continuous improvement of molding and encapsulation equipment (e.g., BIM modules, degating, and…
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Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Drives technology development and enablement for…
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Process and Equipment Engineer System IC Handler and Manipulator (Include Contacting unit) Bosch Batu Kawan, M07, MY Apr 09, 2026Company Description Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd. In Malaysia, Bosch is active in…
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Job Details: ================ Job Description: Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production…
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Job Details: Job Description: Owns critical high volume manufacturing equipment and processes . Recommends and implements modifications for operating the equipment in…
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Nexperia is a world class company in semiconductor development and in house production. We form a global network of talent, with passion…
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Job Details: Job Description: In this position, you will be responsible to own equipment collaterals, improve process and performance of Test module…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Apr 01, 2026About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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Job Details: Job Description: In this position, you will be responsible to own equipment collaterals, improve process and performance of Test module…
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Job Details: Job Description: In this position, you will be responsible for timely deployment, installation, qualification and sustaining of assigned Test equipment…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Mar 17, 2026
About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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About the role Responsible for ensuring high performance, reliability, and continuous improvement of molding and encapsulation equipment (e.g., BIM modules, degating, and…
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Intel Corporation Kulim, M02, MY Mar 12, 2026
Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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Job Details: Job Description: Owns critical high volume manufacturing equipment and processes. Recommends and implements modifications for operating the equipment in order…
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What You Will Do Lead the maintenance and continuous improvement of molding equipment across diverse package types. Equipment down time (DT) monitoring…
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Nexperia is a world class company in semiconductor development and in house production. We form a global network of talent, with passion…
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Job Details: ================ Job Description: Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production…
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If you have experience handling SMT equipment /machines and enjoy troubleshooting, process optimization, and continuous improvement -- we'd love to meet you.…
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Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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