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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Intel Corporation Kulim, M02, MY Mar 12, 2026Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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Job Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation…
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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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Senior Staff Engineer SMT| Semiconductor Industry| Up to 11k Talent Expert Enterprise Melaka, M04, MY Mar 11, 2026
Lead SMT process development activities including process parameter scouting, optimization, verification, and process freeze to meet project targets in timeline, quality, cost,…
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Job Description In your new role you will: Develop the next generation of SiC technologies Develop new voltages classes and broadening the…
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Job Details: Job Description: Owns critical high volume manufacturing equipment and processes. Recommends and implements modifications for operating the equipment in order…
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To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved. Your…
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Job Description In your new role you will: Package Design and Development: Design and develop power module and power package technologies, ensuring…
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Job Details: Job Description: Drives the development and execution of product qualification strategies and plans and adherence to Quality Release Criteria. Performs…
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Extrusion Engineer | Medical Plastic Manufacturing | Pasir Gudang Hirehub Management Sdn Bhd Johor Bahru, M01, MY Mar 10, 2026
Job Summary: This role requires candidate to plan, coordinate, direct, execute and document activities related to extrusion process design and control. Candidate…
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Senior Staff Engineer Package Technology Development Infineon Technologies Ipoh, M08, MY Mar 09, 2026
To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved. Your…
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Job Details: ================ Job Description: The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced…
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Job Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation…
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Overview: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation computing…
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Job Descriptions Conceptualize the assembly process either in semi auto, fully automatic machines or multi purpose fixtures for new products with both…
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Job Description: WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next generation…
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Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
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Job Responsibilities: Successful candidates will be offered a full time permanent job under V.S. Industry Berhad. Candidates will be assigned under SMT…
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Job Descriptions Conceptualize the assembly process either in semi auto, fully automatic machines or multi purpose fixtures for new products with both…
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Job Description Design, develop, and implement mechanical or process engineering solutions for complex systems. Collaborate effectively with counterpart across different countries. Utilize…
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