-
-
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
-
Junior Equipment Technician Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Knowledge and hand on experience on Die Attach…
-
Equipment Junior Technician Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Knowledge and hand on experience on Die Attach…
-
Automation Software Engineering Manager (Chinese Speaker) TG Human Resource Services Sdn. Bhd. Simpang Ampat, M07, MY Mar 23, 2026
The Manager, Automation Software Engineering leads the strategic design and development of advanced automation software platforms for semiconductor and electronics packaging equipment.…
-
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
-
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
-
JOB RESPONSIBILITIES: Responsible for sustaining & improving the Die Attach & Wire Bond Process Overall knowledge on electronics manufacturing and must be…
-
Company Description At Bosch, we shape the future by inventing high quality technologies and services that spark enthusiasm and enrich people's lives.…
-
Company Description At Bosch, we shape the future by inventing high quality technologies and services that spark enthusiasm and enrich people's lives.…
-
Job Description Learn process fundamental for Die attach and Wire bond process Apply data analysis techniques such as Statistical Process Control to…
-
-
Guide a material commodity as technical and quality expert (Mold material and Epoxy Die Attach material supplier). Work closely with Procurement &…
-
Come join Analog Devices (ADI) - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing…
-
Company Description At Bosch, we shape the future by inventing high quality technologies and services that spark enthusiasm and enrich people's lives.…
-
Job Description: Operate equipment related to die attach, wire bonding, coupling, or testing, and perform inspection, supervision, and guidance of their work.…
-
Job Description In your new role you will: Guide a material commodity as technical and quality expert (Mold material and Epoxy Die…
-
Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job.…
-
Company Description At Bosch, we shape the future by inventing high quality technologies and services that spark enthusiasm and enrich people's lives.…
-
Job Description Learn process fundamental for Die attach and Wire bond process Apply data analysis techniques such as Statistical Process Control to…
-
Company Description At Bosch, we shape the future by inventing high quality technologies and services that spark enthusiasm and enrich people's lives.…
-
Capillary Underfill (CUF) Process Technology Development Module Engineer Intel Corporation Kulim, M02, MY Jan 24, 2026Job Details: ================ Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment…
-