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Manager, Process Module Engineering (Packaging Engineering) SanDisk Batu Kawan, Pulau Pinang Feb 12, 2026Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses,…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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About the Role The DACA Equipment Engineer is responsible for ensuring optimal performance, reliability, and uptime of Die Attach and Clip Attach…
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Quality improvement activities on DDM investigation, disposition and improvement. Your Role Key responsibilities in your new role Support production on daily issues…
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Process Development Senior/Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop and optimize EOL processes; especially Package…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Jan 29, 2026About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an…
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This website uses cookies and other tracking technologies to enhance user experience and to analyze performance and traffic on our website. Further…
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JOB RESPONSIBILITIES: Responsible for sustaining & improving the Die Attach & Wire Bond Process Overall knowledge on electronics manufacturing and must be…
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Equipment Technician I (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Experience in DA or WB.…
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Job Functions: The Clip Bond Engineer is responsible for developing, optimizing, and sustaining clip bonding processes used in semiconductor packaging. This role…
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Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Jan 14, 2026
About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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About the Role The DACA Equipment Engineer is responsible for ensuring optimal performance, reliability, and uptime of Die Attach and Clip Attach…
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Manager, Process Module Engineering (Packaging Engineering) SanDisk Batu Kawan, M07, MY Jan 09, 2026
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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