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About the Role As a Senior Engineer specializing in Die Attach and Clip Attach (DACA) processes, you will lead the development, optimization,…
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Equipment Senior Engineer (Die Attach) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Performs design, development, modification and testing…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses,…
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OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses,…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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Equipment Associate Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Experience in DA or WB…
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Die Attach Process Development Senior Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop or optimize Die…
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Equipment Staff Engineer (Die Attach) 1 Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Performs design, development, modification and…
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Process Development Staff Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Jan 18, 2026
Process Development Staff Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop Die Attach &…
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Primary Duties & Responsibilities Responsible for DR8 Gen1.5 Support DR8 Gen1.5 Die attach process. To assist the process engineer in achieving assembly…
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About the Role As a Senior Process Engineer (Die Attach), you will be responsible for developing, improving, and sustaining die attach processes…
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About the Role As a Senior Engineer specializing in Die Attach and Clip Attach (DACA) processes, you will lead the development, optimization,…
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Process and Equipment Module Engineer (DIE Attach or Thermal Compress Bonding) Intel Corporation Kulim, M02, MY Jan 11, 2026Job Details: ================ Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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Job Details: ================ Job Description: The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced…
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Equipment Staff Engineer (Die Attach) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang Your tasks Performs design, development, modification and testing and…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Dec 22, 2025
The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Dec 22, 2025
Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang Your tasks Experience in DA or WB…
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About the Role As a Senior Process Engineer (Die Attach), you will be responsible for developing, improving, and sustaining die attach processes…
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