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To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8 inch wafer conversion TCM and additional customer requirements /qualification for…
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Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Capillary Underfill (CUF) Process Technology Development Module Engineer Intel Corporation Kulim, M02, MY Nov 27, 2025Job Details: ================ Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment…
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Capillary Underfill (CUF) Process Technology Development Module Engineer Intel Kulim, Kedah Nov 27, 2025Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and…
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Staff Engineer, Technology Development (Silicon Failure Analysis) SanDisk Batu Kawan, Pulau Pinang Nov 23, 2025Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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Product Design & Integration Principal Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Lead package design meeting customer…
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Principal Engineer, Chip Development Nitride LEDs Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation of AlInGaN…
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Senior Principal Engineer, Chip Design & Device Development Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation…
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Principal Engineer, Chip Development Nitride LEDs Kulim, Kedah, Malaysia - OSRAM OS Penang What we expect Designing, realization and evaluation of AlInGaN…
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Staff Engineer, Technology Development (Silicon Failure Analysis) SanDisk Batu Kawan, M07, MY Nov 21, 2025
Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and…
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About the role The Senior Engineer (Wirebond Process Development) is responsible for the design, development, optimisation, and industrialisation of wire bonding processes…
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This role involves defining and developing optimal test solutions and handling capabilities for new packages/products. It includes executing buyoff, upgrades, and releases…
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Technology Development Engineer (Solder Resist/Solder Mask, Lamination, Gold/Electroless Plating) AT&S Kulim, M02, MY Nov 14, 2025
Be part of our team! AT&S is a leading global manufacturer of high end IC substrates and printed circuit boards. AT&S industrializes…
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Job Description We are seeking an experienced Principal Engineer to lead and manage geotechnical investigations and engineering design for infrastructure and slope…
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