\ Location: Melaka Job ID: HRC0382317 Job description In your new role you will: Responsible for the technical handshake and knowledge transfer…
\ Our people are ambitious and humble, believing in what they do and convinced that our purpose is shaping a world of…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…
\ Malaysia Job details Posted 18 July 2023 SalaryRM6000 RM10000 per month LocationSelangor Job type Discipline Reference266216_1689679191 Equipment Engineer, Wafer Dicing/Wafer Sawing…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference265382_1687161567 Equipment Engineer (Semiconductor) Job description This global semiconductor…
b\'\ Company Description\ At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ \ Location: Melaka Job ID: HRC0169097 Job description In your new role you will: Sustains and continuously improves qualified technologies in…
\ \ Location: Melaka Job ID: HRC0151289 Job description In your new role you will: Responsible for the technical handshake and knowledge…
\ We can\\\'t predict what the future holds, but we know Texas Instruments will have a part in shaping it. Texas Instruments…
\ Location: Melaka Job ID: HRC0338347 Job description In your new role you will: Sustains and continuously improves qualified technologies in volume…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…
\ Job Description In your new role you will: Sustains and continuously improves qualified technologies in volume production with regards to stability,…
\ \ Job Description In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ Job Description In your new role you will: Responsible for the technical handshake and knowledge transfer to Operation. Support prototype…
\ \ This role required candidate to permanently relocate at Jubail, Saudi Arabia.About the CompanyFounded in the late 1970s in Saudi Arabia\\\'s…
\ Kulim, MY Jan 18, 2024 16127 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ \ This role required candidate to permanently relocate at Jubail, Saudi Arabia.About the CompanyFounded in the late 1970s in Saudi Arabia\\\'s…