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  • Come join Analog Devices (ADI) a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new…

  • Responsible for organization\'s manufacturing assembly processes (wire bond), define product assembly procedures and FMEA. Initiate, direct, and coordinate through the efforts of…

  • Under general supervision and reporting to the Sr. Director of Quality Operations, the ASIC Sustaining Engineer serves as a vital link between…

  • Under general supervision and reporting to the Sr. Director of Quality Operations, the ASIC Sustaining Engineer serves as a vital link between…

  • Engineer Process B. Braun Pulau Pinang Jan 29, 2025

    \ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and improve…

  • Process Development Engineer 2 (New Product Introduction) Dell Bukit Mertajam, Pulau Pinang Jan 29, 2025

    \ Job Description : Process Development Engineering at Dell Technologies spans industrial, manufacturing, electrical and chemical engineering disciplines. It\\\'s a hub of…

  • \ Malaysia Job details Posted 23 August 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference263492_1692797998 Test Process Development Engineer (Semiconductor) Job description My…

  • \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…

  • Wire Bond Engineer Ambition Malaysia Jan 17, 2025

    \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…

  • \ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Equipment Engineering Team Lead Teleflex Kamunting, Perak Jan 08, 2025

    Expected Travel: NoneRequisition ID: 10693About Teleflex IncorporatedAs a global provider of medical technologies, Teleflex is driven by our purpose to improve the…

  • \ Agensi Pekerjaan Asia Recruit Sdn Bhd (200401036859) (675370 W) (JTKSM 230C)\ \ \ \ \ \ \ \ Asia Recruit\ \…

  • Upstream ExxonMobil Kuala Lumpur Jan 05, 2025

    \ ExxonMobil is one of the world\\\'s largest publicly traded energy providers and chemical manufacturers, ExxonMobil develops and applies next generation technologies…

  • \ Job Details Hands on equipment maintenance and installation. Identify any defects or malfunctions and immediately repair and refurbish, as required. Troubleshoot…

  • Welcome Fresh Graduate to APPLY!Job Scope:Research, design, and develop processes to optimize productivity and workflowCreate and develop new procedures and processesCollect data…

  • Process Engineer Technip Energies Kuala Lumpur Jan 02, 2025

    Job Description:About UsAt Technip Energies, we believe in a better tomorrow and we believe we can make tomorrow better. With approximately 15,000…

  • \ Career Opportunities Quality Engineer Job Summary: Ensure product conformance to the Quality requirement of the company and customers. Job Responsible: Determine…

  • Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…

  • Process Engineer NXP Semiconductors Kuala Lumpur Jan 01, 2025

    New Graduate Accelerated Capability Excellence (ACE) New Graduate ACE is a new structured rotating program tailored for NCGs to develop their leadership…