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Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
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Our client is a Semiconductor Multinational company in Melaka. They are looking for an Front of Line Process Engineer.Key Responsibilities: Develop and…
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Welcome to ConocoPhillips, where innovation and excellence create a platform for opportunity and growth. Come realize your full potential here. Who We…
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Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting edge packaging technologies for…
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Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting edge packaging technologies for…
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MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading semiconductor company…
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Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly expanding…
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Here\\\'s the corrected format for the job description:Agensi Pekerjaan Versatile Creation Sdn. Bhd. (2018010011153) 70 1, Bayan Bay, Persiaran Bayan Indah, 11900…
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Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This electronics…
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Process Engineer | Up to RM3,500 + Allowances | Sungai Jawi EMA Agensi Pekerjaan Nibong Tebal, M07, MY Jul 25, 2025
About the company: Our client is a global manufacturer of precision components for molds and dies, supporting industries such as automotive, electronics,…
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\\xef\\xbb\\xbfClient Background: MNC CompanyIndustry : Electronics/MoldingLocation: Senai, Johor.Headcount: 1Position Title: Senior/ Staff Process Development Engineer (Mold Development)Tenure: PermanentRemuneration: RM6,000 RM9,000ResponsibilitiesNew Product/Process Development…
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MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
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MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
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MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading semiconductor company…
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MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
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MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
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MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur client is…
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MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company in Melaka…
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MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design…
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About usYour Contribution Responsible to develop and optimize new manufacturing process in the area of automated glass wafer bonding, glass wafer stacking…
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