As a Senior Critical Environment Technician (CET) in Microsofts Cloud Operations & Innovation (CO+I) team, you will maintain the critical infrastructure that…
\ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
Company DescriptionAt Western Digital, we are on a mission to unlock the potential of data so people, companies and organizations everywhere can…
In alignment with our Microsoft values, we are committed to cultivating an inclusive work environment for all employees to positively impact our…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ \ Location: Melaka, Melaka Job ID: HRC0809430Job description In your new role you will: Perform process development activities (process parameters scouting,…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1732267956Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…
b\' Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Malaysia Job details Posted 10 September 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1694277399 Process Engineer, Die Bond Job…
At Jabil we strive to make ANYTHING POSSIBLE and EVERYTHING BETTER. With over 260,000 diverse, talented and dedicated employees across 100 locations…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryRM5000 RM8000 per annum\ \ \ LocationMalaysia\ \ \…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryNegotiable\ \ \ LocationSelangor\ \ \ Job type Permanent…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer who specializes in Soft…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…