\ Available Positions: Equipment Engineer/ Senior Engineer Process Engineer/ Senior Engineer Job Responsibilities: 1.Equipment Engineer/ Senior Engineer: Lead in project management and…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ \ Powering Positive Change\\xe2\\x84\\xa2 In a world of constant change, the only way to make a meaningful impact is to stay…
\ \ Kulim, MY Apr 30, 2024 16594 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ \ Location: Melaka Job ID: HRC0151289 Job description In your new role you will: Responsible for the technical handshake and knowledge…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ Location: Kulim Job ID: 341151 Job description In your new role you will: Perform root cause analysis for ICO/FAR related…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer who specializes in Soft…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1732267956Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ In alignment with our Microsoft values, we are committed to cultivating an inclusive work environment for all employees to positively…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…