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senior process development technician smt die attach process
Jobs 221 - 240 of 107457
  • \ Available Positions: Equipment Engineer/ Senior Engineer Process Engineer/ Senior Engineer Job Responsibilities: 1.Equipment Engineer/ Senior Engineer: Lead in project management and…

  • Die Prep Technician Western Digital Batu Kawan, Pulau Pinang Dec 20, 2024

    \ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…

  • \ \ Powering Positive Change\\xe2\\x84\\xa2 In a world of constant change, the only way to make a meaningful impact is to stay…

  • Process Engineer Production (Assembly) AT&S Kulim, Kedah Dec 18, 2024

    \ \ Kulim, MY Apr 30, 2024 16594 Be part of our team! AT&S, a world leading high tech PCB & IC…

  • \ \ Location: Melaka Job ID: HRC0151289 Job description In your new role you will: Responsible for the technical handshake and knowledge…

  • Staff Engineer, Packaging Engineering Western Digital Perai, Pulau Pinang Dec 16, 2024

    \ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…

  • \ \ Location: Kulim Job ID: 341151 Job description In your new role you will: Perform root cause analysis for ICO/FAR related…

  • Staff Engineer, Packaging Engineering Western Digital Batu Kawan, Pulau Pinang Dec 15, 2024

    \ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…

  • Die Bond Development Engineer Ambition Selangor Dec 14, 2024

    \ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer who specializes in Soft…

  • \ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…

  • \ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…

  • Die Bond Development Engineer Ambition Malaysia Nov 30, 2024

    MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1732267956Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…

  • Die Bond Process Engineer Ambition Malaysia Nov 22, 2024

    \ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…

  • Die Bond Development Engineer Ambition Malaysia Nov 21, 2024

    \ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Die Bond Development Engineer Ambition Malaysia Nov 18, 2024

    \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Die Bond Development Engineer Ambition Malaysia Nov 16, 2024

    \ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Die Bond Process Engineer Ambition Malaysia Nov 15, 2024

    \ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…

  • Senior Critical Environment Technician Microsoft Kuala Lumpur - Selangor Nov 12, 2024

    \ \ In alignment with our Microsoft values, we are committed to cultivating an inclusive work environment for all employees to positively…

  • Die Bond Process Engineer Ambition Malaysia Nov 02, 2024

    \ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…

  • \ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…