\ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ Company Description SOCOE is a technology driven company located in Kuching. We are passionate about fostering a diverse and innovative…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Open Position: Senior Engineer, Staff Engineer (MNC Semiconductor) An MNC Semiconductor company in Penang is looking for Senior Engineer and Staff…
\ \ \\xef\\xbb\\xbfClient Background: MNC CompanyIndustry : Electronics/MoldingLocation: Senai, Johor.Headcount: 1Position Title: Senior/ Staff Process Development Engineer (Mold Development)Tenure: PermanentRemuneration: RM6,000 RM9,000ResponsibilitiesNew…
\ \ Open Position: Senior Engineer, Staff Engineer (MNC Semiconductor)An MNC Semiconductor company in Penang is looking for Senior Engineer and Staff…
\ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and improve…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…