MohonKelayakanQualifications & Experience: Mechanical or Manufacturing Engineering in Diploma or Degree holder Minimum 5 years related working experience in sheet metal fabrication…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
e.target.src = \'https://files.ajobthing.com/assets/premium job/premium default banner.png\'" class="object contain aspect companyBanner w full" data v 47a6e178>Engineer/ Senior Npi EngineerFollowUndisclosed,Be an early applicant!Posted 25…
\ Kulim, MY Feb 20, 2024 16323 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
Job Description: About Dexcom Founded in 1999, Dexcom, Inc. (NASDAQ: DXCM), develops and markets Continuous Glucose Monitoring (CGM) systems for ambulatory use…
\ \\xef\\xbb\\xbf Reports to: Technical Specialist PI Segment Johor Bahru Key Purpose of the Role: Strategic Outcome: Deputy to Senior Service Engineer/Team…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…
\ Status POSITION : Senior Electrical Engineer REPORTING TO : Head of Maintenance Engineering and Reliability DIVISION/DEPARTMENT : PBF/M LOCATION : KL…
Powering Positive Change In a world of constant change, the only way to make a meaningful impact is to stay ahead of…
Sarawak, MalaysiaJob Family Group: Discipline EngineeringWorker Type: RegularPosting Start Date:Business unit: Integrated Gas and UpstreamExperience Level: Experienced ProfessionalsJob Description:If you are an…
Powering Positive Change In a world of constant change, the only way to make a meaningful impact is to stay ahead of…
Location: Senai i ParkJob Summary:We are the global leader in sleep technology and our devices transform care and lives for people with…
Powering Positive Change In a world of constant change, the only way to make a meaningful impact is to stay ahead of…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Req ID: 118819 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Quality (QUA) Career…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
\ Req ID: 118918 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Quality (QUA) Career…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Job Description .Semiconductor process tooling design (ejector, stencil, Flip chip cover, Jig .) .Substrate strip outline design .Co work with vendor…