\ Location: Melaka Job ID: HRC0472631 Job description In your new role you will: To drive wire bond planned maintenance systematic &…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Company Description Continental develops pioneering technologies and services for sustainable and connected mobility of people and their goods. Founded in 1871,…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Our vision is to transform how the world uses information to enrich life for all. \ Micron Technology is a world…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationPerak Job type Discipline Reference276684_1732267324Assembly Package Development EngineerJob descriptionThis global semiconductor company in Perak is…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryRM5000 RM8000 per annum\ \ \ LocationMalaysia\ \ \…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…
\ Location: Melaka Job ID: HRC0338347 Job description In your new role you will: Sustains and continuously improves qualified technologies in volume…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Job Description In your new role you will: Sustains and continuously improves qualified technologies in volume production with regards to stability,…
\ Job Description In your new role you will: Develop and realize process & maintenance concepts. Support new product & equipment for…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…