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About Centific Centific is a frontier AI data foundry that curates diverse, high quality data, using our purpose built technology platforms to…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Collaborate with engineers to design and implement automation workflows for test program release. Develop scripts and tools to integrate with CI/CD pipelines.…
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Collaborate with engineers to design and implement automation workflows for test program release. Develop scripts and tools to integrate with CI/CD pipelines.…
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Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Feb 21, 2026
The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Feb 21, 2026
Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang Your tasks Experience in DA or WB…
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Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in…
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Process Development Senior/Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop and optimize EOL processes; especially Package…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Equipment Associate Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Experience in DA or WB…
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Die Attach Process Development Senior Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop or optimize Die…
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JOB RESPONSIBILITIES: Responsible for sustaining & improving the Die Attach & Wire Bond Process Overall knowledge on electronics manufacturing and must be…
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Job Functions: The Clip Bond Engineer is responsible for developing, optimizing, and sustaining clip bonding processes used in semiconductor packaging. This role…
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Process Development Staff Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Jan 18, 2026
Process Development Staff Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop Die Attach &…
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Primary Duties & Responsibilities Responsible for DR8 Gen1.5 Support DR8 Gen1.5 Die attach process. To assist the process engineer in achieving assembly…
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Company Description At Bosch, we shape the future by inventing high quality technologies and services that spark enthusiasm and enrich people's lives.…
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Maintenance Technician (Die Bond/Wire Bond/AVI/Encapsulation/Plating/Sawing/Testing) DOMINANT OPTO TECHNOLOGIES SDN.BHD Melaka, M04, MY Jan 11, 2026
Responsibilities : Carry out routine tasks of a planned maintenance course such as undertaking simple servicing, adjustments and alignments of mechanical elements.…
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Job Summary: onsemi is seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding, Back…
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1. Responsible for developing and coding for the existing equipment application or system application. 2. Design and develop control, machine software &…
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