\ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ Req ID: 120717 Remote Position: No Region: Asia Country: Malaysia State/Province: Penang City: PenangSummaryThe Staff Engineer, Electrical Design develops new…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Job Description In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index…
\ \ \\xef\\xbb\\xbfClient Background: MNC CompanyIndustry : Electronics/MoldingLocation: Senai, Johor.Headcount: 1Position Title: Senior/ Staff Process Development Engineer (Mold Development)Tenure: PermanentRemuneration: RM6,000 RM9,000ResponsibilitiesNew…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
About the job Assembly Staff EngineerCompany BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Location: Melaka Job ID: HRC0747472Job description In your new role you will: Yield improvement activities for Die Attach process Sustain…
Process Development Staff/Senior Staff Engineer (PVD/ALD/Anneal) Kulim, Malaysia OSRAM OS Penang What we expect Develop (or transfer from Regensburg) Metal Processes to…
\ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and improve…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…