\ \ Malaysia Job details Posted 11 March 2023 SalaryNegotiable LocationMalacca Job type Discipline ReferenceBBBH253724_1678469379 Test Process Engineer (Semiconductor) Job description My…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…
\ Job Description We are looking for highly driven individuals to be part of the Assembly manufacturing facility in Kulim Site as…
\ Job Description: Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a…
\ \\xef\\xbb\\xbf Client Background: leading analog/mixed signal foundry manufacturing silicon wafers Industry: Semiconductor Location: Sarawak Position: AMHS Equipment Engineer Tenure: Permanent Job…
\ Client Background: leading analog/mixed signal foundry manufacturing silicon wafers Industry: Semiconductor Location: Sarawak Position: AMHS Equipment Engineer Tenure: Permanent Job Responsibilities:…
\ \ MalaysiaJob details Posted 13 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1715569407Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Kulim, MY Nov 28, 2023 16199 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ Malaysia Job details Posted 19 June 2023 SalaryRM6000 RM10000 per month LocationSelangor Job type Discipline Reference266216_1687162477 Equipment Engineer, Wafer Dicing/Wafer Sawing…
\ Kulim, MY Nov 28, 2023 16198 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
b\'Job Purpose\ Provide oversea clients with technical support for PVD/CVD equipments, including installation, testing,debugging,maintenance,etc.\ Duties and Responsibilities\ 1\\xef\\xbc\\x8e Responsible for solar PV…
\ \ Kulim, MY Mar 5, 2024 16444 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 18 July 2023 SalaryNegotiable LocationMalacca Job type Discipline ReferenceBBBH253724_1689678813 Test Process Engineer (Semiconductor) Job description My client…
\ Malaysia Job details Posted 18 July 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference263492_1689678732 Test Process Development Engineer (Semiconductor) Job description My…
\ Malaysia Job details Posted 18 July 2023 SalaryRM6000 RM10000 per month LocationSelangor Job type Discipline Reference266216_1689679191 Equipment Engineer, Wafer Dicing/Wafer Sawing…
\ \ Malaysia Job details Posted 10 March 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference262955_1678439223 Wet Process Engineer (Semiconductor) Job description This…
\ \ Kulim, MY Mar 5, 2024 16394 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ Malaysia Job details Posted 12 September 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1694500453 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference265382_1687161567 Equipment Engineer (Semiconductor) Job description This global semiconductor…