\ Kulim, MY Nov 28, 2023 16199 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ \ Kulim, MY Mar 5, 2024 16444 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Kulim, MY Nov 28, 2023 16198 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
b\'Job Purpose\ Provide oversea clients with technical support for PVD/CVD equipments, including installation, testing,debugging,maintenance,etc.\ Duties and Responsibilities\ 1\\xef\\xbc\\x8e Responsible for solar PV…
\ Malaysia Job details Posted 19 June 2023 SalaryRM6000 RM10000 per month LocationSelangor Job type Discipline Reference266216_1687162477 Equipment Engineer, Wafer Dicing/Wafer Sawing…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 18 July 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference263492_1689678732 Test Process Development Engineer (Semiconductor) Job description My…
\ Malaysia Job details Posted 18 July 2023 SalaryNegotiable LocationMalacca Job type Discipline ReferenceBBBH253724_1689678813 Test Process Engineer (Semiconductor) Job description My client…
\ Malaysia Job details Posted 18 July 2023 SalaryRM6000 RM10000 per month LocationSelangor Job type Discipline Reference266216_1689679191 Equipment Engineer, Wafer Dicing/Wafer Sawing…
\ \ Malaysia Job details Posted 10 March 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference262955_1678439223 Wet Process Engineer (Semiconductor) Job description This…
\ \ Kulim, MY Mar 5, 2024 16394 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ Malaysia Job details Posted 12 September 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1694500453 Die Bond Equipment Engineer Job description This rapidly…
\ \ We can\\\'t predict what the future holds, but we know Texas Instruments will have a part in shaping it. Are…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference265382_1687161567 Equipment Engineer (Semiconductor) Job description This global semiconductor…
\ \ We can\\\'t predict what the future holds, but we know Texas Instruments will have a part in shaping it. Are…
\ \ MalaysiaJob details Posted 13 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1715569407Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 18 January 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1705541484 Die Bond Equipment Engineer Job description This rapidly…
\ Company DescriptionBosch in Malaysia is a part of the Bosch Group, a leading global supplier of technology and services. The Bosch…
\ Job Description: Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a…