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equipment engineer semiconductor
Jobs 21 - 40 of 35022
  • \ \ Job Purpose: This position manage the rotating engineering group and is a leading member of the Engineering Team in SapuraOMV…

  • Rotating Equipment Engineer Shell Miri, Sarawak Nov 19, 2024

    \ \ Sarawak, MalaysiaJob Family Group: Discipline EngineeringWorker Type: RegularPosting Start Date:Business unit: Integrated Gas and UpstreamExperience Level: Experienced ProfessionalsJob Description:If you…

  • Equipment Engineer Flex Pulau Pinang Nov 18, 2024

    \ Flex, a Fortune global 500 company, is the diversified manufacturing partner of choice that helps market leading brands design, build and…

  • Rotating Equipment Engineer Shell Sarawak Nov 17, 2024

    \ \ Sarawak, Malaysia Job Family Group: Discipline Engineering Worker Type: Regular Posting Start Date: October 13, 2022 Business unit: Upstream Experience…

  • Test Equipment Engineer Flex Pulau Pinang Nov 17, 2024

    \ Flex, a Fortune global 500 company, is the diversified manufacturing partner of choice that helps market leading brands design, build and…

  • \ Malaysia Job details Posted 18 July 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference255395_1689678958 Process Engineer (Semiconductor) Job description This semiconductor company…

  • Equipment Engineer (SMT) Wistron Technology (Malaysia) Sdn Bhd Pelabuhan Klang, Selangor Nov 16, 2024

    \ \ e.target.src = \\\'https://files.ajobthing.com/assets/premium job/premium default banner.png\\\'\" class=\"object contain aspect companyBanner w full\" data v 5b2d4898>Equipment Engineer (SMT)FollowMYR3,000 MYR5,000 Per Month,Fewer…

  • Position: Equipment Engineer Salary: SGD 4000 SGD 5500 Allowance: Travel Allowance, accommodation and transportation provide when outstation. Working conditions: Working in clean…

  • \ Malaysia Job details Posted 18 July 2023 SalaryNegotiable LocationMalaysia Job type Discipline ReferenceBBBH254215_1689679004 Quality Assurance Engineer (Semiconductor) Job description A global…

  • FCI Process/Equipment Engineer HP Pulau Pinang Nov 11, 2024

    \ \ FCI Process/Equipment Engineer Description Applies intermediate level of subject matter knowledge to solve a variety of common business issues. Works…

  • Senior/ Equipment Engineer (Assembly) AT&S Kulim, Kedah Nov 10, 2024

    \ Kulim, MY Nov 28, 2023 16203 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…

  • MaxQFP Equipment Engineer NXP Semiconductors Kuala Lumpur Nov 08, 2024

    \ Job Profile EQUIPMENT ENGINEER Job Description The Equipment Engineer is responsible for innovation and improvement in our injection molding. This is…

  • Die Bond Equipment Engineer Ambition Malaysia Oct 18, 2024

    \ \ MalaysiaJob details Posted 13 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1715569407Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Die Bond Equipment Engineer Ambition Malaysia Oct 17, 2024

    \ Malaysia Job details Posted 18 January 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1705541484 Die Bond Equipment Engineer Job description This rapidly…

  • Process & Equipment Engineer (Loader & Unloader) Bosch Perai, Pulau Pinang Oct 16, 2024

    \ Company DescriptionBosch in Malaysia is a part of the Bosch Group, a leading global supplier of technology and services. The Bosch…

  • \ We can\\\'t predict what the future holds, but we know Texas Instruments will have a part in shaping it. Texas Instruments…

  • \ Malaysia Job details Posted 23 August 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference263492_1692797998 Test Process Development Engineer (Semiconductor) Job description My…

  • Process Equipment Engineer Intel Kedah Sep 23, 2024

    \ Job Description We are looking for highly driven individuals to be part of the Assembly manufacturing facility in Kulim Site as…

  • Die Bond Equipment Engineer Ambition Malaysia Sep 23, 2024

    \ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…

  • \ \ Malaysia Job details Posted 11 March 2023 SalaryNegotiable LocationMalacca Job type Discipline ReferenceBBBH253724_1678469379 Test Process Engineer (Semiconductor) Job description My…