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  • Lead Packaging Development Engineer Dyson Johor Bahru, Johor Nov 17, 2024

    \ Summary Salary: Competitive Team: Design and Development Location: Malaysia Global Development Campus, Johor Bahru Overview Department: Dyson is a global technology…

  • \ \ Job Description In your new role you will: Responsible for the technical handshake and knowledge transfer to Operation. Support prototype…

  • \ \ Location : Senai, JohorBasic Salary : Up to RM 4,500Phone Allowance : RM 50Travelling Allowance : RM100Product Life cycle and…

  • Engineer Process Data SSW Shell Cyberjaya, Selangor Nov 16, 2024

    \ Selangor, Malaysia Job Family Group: Information and Data Worker Type: Regular Posting Start Date: August 14, 2023 Business unit: Projects and…

  • Lead Packaging Development Engineer Dyson Johor Bahru, Johor Nov 16, 2024

    \ Summary Salary: Competitive Team: Design and Development Location: Malaysia Global Development Campus, Johor Bahru Overview Department: Dyson is a global technology…

  • \ \ Req ID: 121809 Remote Position: No Region: Asia Country: Malaysia State/Province: Penang City: PenangGeneral OverviewFunctional Area: Engineering Career Stream: Design…

  • Wire Bond Process Engineer Ambition Malaysia Nov 16, 2024

    \ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…

  • Senior Tooling Engineer Dyson Malaysia Nov 15, 2024

    \ \ About us We are looking for a Senior Tooling Engineer to lead and execute tool design activities and molding process…

  • Graduate Test Development Engineer Dyson Johor Bahru, Johor Nov 15, 2024

    \ \ Summary Salary: Competitive Team: Graduates, Interns and Apprentices Location: Malaysia Global Development Campus, Johor BahruAbout usWe are part of a…

  • Engineer, Process Development Analog Devices Pulau Pinang Nov 15, 2024

    \ \ Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs…

  • Die Bond Process Engineer Ambition Malaysia Nov 15, 2024

    \ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…

  • IT Engineer Automation Development Micron Batu Kawan, Pulau Pinang Nov 15, 2024

    \ Job Description:Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader…

  • b\'\ Company Description\ At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…

  • Senior R&D Engineer Teleflex Kulim, Kedah Nov 14, 2024

    \ Expected Travel: Up to 10% Requisition ID: 8394 About Teleflex Incorporated Teleflex is a global provider of clinically effective medical technologies…

  • Molding Engineer Flex Pulau Pinang Nov 14, 2024

    \ Flex, a Fortune global 500 company, is the diversified manufacturing partner of choice that helps market leading brands design, build and…

  • Process Engineer Sealed Air Kuantan, Pahang Nov 14, 2024

    \ Location:Kuantan (26080) Salary:CompetitiveType:PermanentMain Industry:Other Industries & Skills:Purchasing & Supply ChainAdvertiser:Job ID:131057794Posted On:06 September 2024Sealed Air designs and delivers packaging solutions that…

  • \ \ Job Description In your new role you will: Responsible for the technical handshake and knowledge transfer to Operation. Support prototype…

  • \ \ Exciting opportunity for an experienced Process Project Principal Engineer to join a global leading solar company in Sarawak. If candidates…

  • Process and Material Development Engineer Bansam Sdn Bhd Iskandar Puteri, Johor Nov 13, 2024

    \ \ Process and Material Development EngineerBansam Sdn BhdIskandar Puteri, JohorProcess Engineering (Engineering)Full timeRM 3,333 \\xe2\\x80\\x93 RM 5,000 per monthMaterial Development Conduct…

  • \ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…