\xef\xbb\xbfClient Background: MNC CompanyIndustry: ManufacturingLocation: Iskandar Puteri, JBHeadcount: 1Position Title: Process Engineer (VMI Visual Inspection)Remuneration: RM 4,000 RM8,000Job Description:\xc2\xb7 Manage and own…
\xef\xbb\xbfClient Background: MNC CompanyIndustry : Steel Fabricator ManufacturingLocation: Iskandar Puteri, JBHeadcount: 1Position Title: Process Engineer (Heat Treatment)Tenure: PermanentRemuneration: RM 3,000 RM 6,000Responsibilities:\xe2\x96\xaa…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Kulim, MY Feb 27, 2024 16349 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Kulim, MY Jan 17, 2024 16349 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ \ Job Description In your new role you will: Quality improvement activities on DDM investigation, disposition and improvement Yield improvement activities…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ Location: Melaka Job ID: HRC0728671Job description In your new role you will: Quality improvement activities on DDM investigation, disposition and…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…