\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ Job Description In your new role you will: Responsible for the technical handshake and knowledge transfer to Operation. Support prototype…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Job Description In your new role you will: Responsible for the technical handshake and knowledge transfer to Operation. Support prototype…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Location: Melaka Job ID: HRC0472631 Job description In your new role you will: To drive wire bond planned maintenance systematic &…
\ Who is our client and your future employer? \ Ranked among the world\\xe2\\x80\\x99s largest petrochemicals manufacturers, it is a public company…
\ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers at…
\ Career Opportunities Quality Engineer Job Summary: Ensure product conformance to the Quality requirement of the company and customers. Job Responsible: Determine…
\ Location: Melaka, Melaka Job ID: HRC0519776 Job description In your new role you will: To sustain, improve the process in order…
\ Location: Melaka Job ID: HRC0382317 Job description In your new role you will: Responsible for the technical handshake and knowledge transfer…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276832_1732265868Wire Bond Development EngineerJob descriptionOur client is a semiconductor MNC in…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryRM15000 RM21000 per month LocationMalaysia Job type Discipline Reference273052_1721349840Sr Process Engineering Manager (Wire Bond)Job…
\ \ Location: Melaka Job ID: HRC0151289 Job description In your new role you will: Responsible for the technical handshake and knowledge…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…