MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
\ Req ID: 117314 Remote Position: No Region: Asia Country: Malaysia State/Province: Penang City: Penang General Overview Job Title: Staff Engineer, Systems/Applications…
\ \ Req ID: 120433 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: PenangSummaryThe Senior Staff Engineer, Hardware Design…
\ \ MalaysiaJob details Posted 19 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1716051585Wire Bond Process Development ManagerJob descriptionOur client is a…
\ Req ID: 116976 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Job Title: Staff Engineer,…
\ \ HierarchyPOSITION : Staff Engineer, MechanicalREPORTING TO : Head, Maintenance Engineering & ReliabilityDIVISION/DEPARTMENT : PBF/M Maintenance Engineering & ReliabilityLOCATION : KL…
\ Location: Melaka Job ID: HRC0324116 Workplace type: On site Job description In your new role you will: Accountable and responsible for…
\ \ Req ID: 121158 Remote Position: No Region: Asia Country: Malaysia State/Province: Penang City: PenangGeneral OverviewJob Title: Staff Engineer, Hardware Design…
\ \\xe2\\x80\\x8b10 Staff Engineer, Electrical Design Req ID: 119566 Remote Position: No Hiring Manager: , Ng Kay Ming Band: 10 Region: Asia…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1721349295Wire Bond Process Development ManagerJob descriptionOur client is a…
\ Company BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based power electronic solutions. As…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
About the job Assembly Staff EngineerCompany BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…