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Jobs 21 - 40 of 55155
  • \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • \ Req ID: 117314 Remote Position: No Region: Asia Country: Malaysia State/Province: Penang City: Penang General Overview Job Title: Staff Engineer, Systems/Applications…

  • \ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…

  • Wire Bond Process Manager Ambition Malaysia Nov 18, 2024

    \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…

  • \ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…

  • \ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…

  • Staff Engineer, Electrical Design Celestica Pulau Pinang Nov 17, 2024

    \ \ Req ID: 120717 Remote Position: No Region: Asia Country: Malaysia State/Province: Penang City: PenangSummaryThe Staff Engineer, Electrical Design develops new…

  • Wire Bond Process Engineer Ambition Malaysia Nov 16, 2024

    \ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…

  • \ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and improve…

  • \ Location: Melaka Job ID: HRC0472646 Job description In your new role you will: To drive wire bond planned maintenance systematic &…

  • \ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…

  • Assembly Staff Engineer Talent Recruit Ipoh, Perak Nov 15, 2024

    \ Company BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based power electronic solutions. As…

  • \ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • b\'\ \ Reliability Staff Engineer\ Kulim, Kedah, Malaysia \\xe2\\x80\\x93 OSRAM OS Penang\ \ \ Deine Aufgaben\ \ \ Establish Project Specific Reliability…

  • \ \\xe2\\x80\\x8b11 Senior Staff Engineer, Product Line Management Req ID: 117781 Remote Position: No Hiring Manager: Matt Roman Band: 11 Region: Asia…

  • \ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…

  • \ \ MalaysiaJob details Posted 19 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1716051585Wire Bond Process Development ManagerJob descriptionOur client is a…

  • \ \ MalaysiaJob details Posted 19 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1721349295Wire Bond Process Development ManagerJob descriptionOur client is a…

  • \ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…

  • \ Job Description In your new role you will: Develop and realize process & maintenance concepts. Support new product & equipment for…