\ Job Description In your new role you will: Manage maintenance cost in sustaining the equipment to it fullest performance. Gather previous…
\ Location: Melaka Job ID: HRC0674345 Job description In your new role you will: Manage maintenance cost in sustaining the equipment to…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ Req ID: 120717 Remote Position: No Region: Asia Country: Malaysia State/Province: Penang City: PenangSummaryThe Staff Engineer, Electrical Design develops new…
\ \ Location: Melaka, Melaka Job ID: HRC0640576 Workplace type: On siteJob description In your new role you will: Drive and build…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
Analog Devices, Inc. (NASDAQ: ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Good discipline and behavior, willing to learn and grow. Shift technician support production to achieve…
About the job Assembly Staff EngineerCompany BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based…
\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…
\ \ Location: Melaka, Melaka Job ID: HRC0519773 Workplace type: On siteJob description In your new role you will: To sustain, improve…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…