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  • Wire Bond Engineer Ambition Malaysia Nov 21, 2024

    \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…

  • \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Wire Bond Process Manager Ambition Malaysia Nov 18, 2024

    \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…

  • \ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…

  • \ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…

  • Wire Bond Process Engineer Ambition Malaysia Nov 16, 2024

    \ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…

  • Assembly Staff Engineer Talent Recruit Ipoh, Perak Nov 15, 2024

    \ Company BackgroundWe are representing world known company with a global footprint that provides high performance, semiconductor based power electronic solutions. As…

  • \ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • \ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…

  • \ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…

  • \ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…

  • \ \ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and…

  • \ \ Location: Melaka, Melaka Job ID: HRC0519773 Workplace type: On siteJob description In your new role you will: To sustain, improve…

  • \ \ Location: Melaka Job ID: HRC0169097 Job description In your new role you will: Sustains and continuously improves qualified technologies in…

  • \ \ Location: Melaka Job ID: HRC0774592Job description In your new role you will: To sustain, improve the process in order to…

  • \ \ Location: Melaka Job ID: HRC0775119Job description In your new role you will: To sustain, improve the process in order to…

  • Staff Engineer, Process Engineering Western Digital Perai, Pulau Pinang Oct 12, 2024

    \ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…

  • \ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…

  • \ Location: Melaka Job ID: HRC0674345 Job description In your new role you will: Manage maintenance cost in sustaining the equipment to…

  • \ Job Description In your new role you will: Manage maintenance cost in sustaining the equipment to it fullest performance. Gather previous…