\ Your Contribution Responsible to develop and optimize new process flows for new optical component products. In charge to develop the Process…
\ Job Description Engineer will be responsible for analyze, clarify, translate method into practice and vice versa to improve and strengthen the…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ JOB RESPONSIBILITIES To setup designated process for New Semiconductor Line (front end to back end) To develop and industrialize designated semiconductor…
\ Malaysia Job details Posted 19 June 2023 SalaryRM6000 RM10000 per month LocationSelangor Job type Discipline Reference266216_1687162477 Equipment Engineer, Wafer Dicing/Wafer Sawing…
\ \ Location: Melaka Job ID: HRC0747472Job description In your new role you will: Yield improvement activities for Die Attach process Sustain…
\ \ Job Description In your new role you will: Quality improvement activities on DDM investigation, disposition and improvement Yield improvement activities…
\ \ Location: Melaka Job ID: HRC0728671Job description In your new role you will: Quality improvement activities on DDM investigation, disposition and…
\ Our people are ambitious and humble, believing in what they do and convinced that our purpose is shaping a world of…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276832_1732265868Wire Bond Development EngineerJob descriptionOur client is a semiconductor MNC in…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…
\ Malaysia Job details Posted 18 July 2023 SalaryRM6000 RM10000 per month LocationSelangor Job type Discipline Reference266216_1689679191 Equipment Engineer, Wafer Dicing/Wafer Sawing…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference265382_1687161567 Equipment Engineer (Semiconductor) Job description This global semiconductor…
b\' Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ We can\\\'t predict what the future holds, but we know Texas Instruments will have a part in shaping it. Texas Instruments…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
\ Location: Melaka Job ID: HRC0338347 Job description In your new role you will: Sustains and continuously improves qualified technologies in volume…
\ \ Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…