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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Apr 19, 2026
Equipment Senior Technician/Associate Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang Your tasks Experience in DA or WB…
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About the Role As a Senior Process Engineer (Die Attach), you will be responsible for developing, improving, and sustaining die attach processes…
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Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment…
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As a Senior Equipment Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in…
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Job Details: Job Description: Owns critical high volume manufacturing equipment and processes. Recommends and implements modifications for operating the equipment in order…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Apr 01, 2026
About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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As a Senior Equipment Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in…
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Equipment Technician I (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Experience in DA or WB.…
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Die Bond / Wire Bond Process Development Senior Staff Engineer ams OSRAM Bayan Lepas, M07, MY Mar 23, 2026
The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Equipment Associate Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Experience in DA or WB…
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Process Development Staff Engineer (Die Attach/Wire Bond) ams OSRAM Bayan Lepas, M07, MY Mar 22, 2026
Process Development Staff Engineer (Die Attach/Wire Bond) Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop Die Attach &…
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About the Role As a Senior Process Engineer (Die Attach), you will be responsible for developing, improving, and sustaining die attach processes…
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PROCESS & EQUIPMENT ENGINEER BACKEND/LABELING ENGINEERING Job Summary Develop or maintain a highly effective plan to meet the high standard of operation…
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Job Description As a Die Bond & Wire Bond Engineer, you will be part of a dynamic manufacturing team, supporting semiconductor assembly…
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Die Bond / Wire Bond Process Development Senior Staff Engineer ams OSRAM Bayan Lepas, M07, MY Mar 20, 2026
Die Bond / Wire Bond Process Development Senior Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Mar 17, 2026
About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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