\ Job Description In your new role you will: Develop and realize process & maintenance concepts. Support new product & equipment for…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
You\'re an important part of our future. Hopefully, we\'re also a part of yours! At B. Braun, we protect and improve the…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
You\'re an important part of our future. Hopefully, we\'re also a part of yours! At B. Braun, we protect and improve the…
\ \ You\\\'re an important part of our future. Hopefully, we\\\'re also a part of yours! At B. Braun, we protect and…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ Job Description In your new role you will: To drive wire bond planned maintenance systematic & methodology to ensure machine performance…
\ Location: Melaka Job ID: HRC0472631 Job description In your new role you will: To drive wire bond planned maintenance systematic &…
\ \ Location: Melaka Job ID: HRC0200996 Job description In your new role you will: Monitor & sustain machine OEE performance, quality…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276832_1732265868Wire Bond Development EngineerJob descriptionOur client is a semiconductor MNC in…
\ Location: Melaka Job ID: HRC0372399 Job description In your new role you will: Develop and realize process & maintenance concepts. Support…
\ \ Job Description In your new role you will: Monitor & sustain machine OEE performance, quality and yield of assembly processes…
\ \ Location: Melaka Job ID: HRC0800334Job description In your new role you will: Trouble shoot and diagnose difficult, infrequent problems in…
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…