\ \ Job Description In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Roles and Responsibilities Responsible for Quality, Yield, Cost and Productivity improvement activities related to Pre Assembly and Die Attach process in…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ Job Description In your new role you will: Implement Process development activities (Process parameters scouting, optimization, verification and Process Freeze)…
\ \ Location: Melaka Job ID: HRC0734182Job description In your new role you will: Implement Process development activities (Process parameters scouting, optimization,…
\ \ Location: Melaka Job ID: HRC0747472Job description In your new role you will: Yield improvement activities for Die Attach process Sustain…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ \ Location: Melaka Job ID: HRC0728671Job description In your new role you will: Quality improvement activities on DDM investigation, disposition and…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Malaysia Job details Posted 10 September 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1694277399 Process Engineer, Die Bond Job…
\ \ At Jabil we strive to make ANYTHING POSSIBLE and EVERYTHING BETTER. With over 260,000 diverse, talented and dedicated employees across…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryRM5000 RM8000 per annum\ \ \ LocationMalaysia\ \ \…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…