Upload your CV and easily apply to jobs from any device!

City

Top Companies

Salary Range

senior engineer equipment engineering sustenance die attach
Jobs 161 - 180 of 30223
  • Senior Electrical Engineering Specialist Shell Bintulu, Sarawak Feb 08, 2025

    Sarawak, MalaysiaJob Family Group: Discipline EngineeringWorker Type: RegularPosting Start Date: January 24, 2025Business unit: Integrated Gas and UpstreamExperience Level: Experienced ProfessionalsJob Description:Where…

  • Come join Analog Devices (ADI) a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new…

  • MohonKelayakanQualifications & Experience: Mechanical or Manufacturing Engineering in Diploma or Degree holder Minimum 5 years related working experience in sheet metal fabrication…

  • e.target.src = \'https://files.ajobthing.com/assets/premium job/premium default banner.png\'" class="object contain aspect companyBanner w full" data v 47a6e178>Engineer/ Senior Npi EngineerFollowUndisclosed,Be an early applicant!Posted 25…

  • Reliability Lab Engineer/ Specialist AT&S Kulim, Kedah Jan 26, 2025

    \ Kulim, MY Feb 20, 2024 16323 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…

  • Sarawak, Malaysia Job Family Group: Discipline Engineering Worker Type: Regular (FTC) (Fixed Term) Posting Start Date: Business unit: Projects and Technology Experience…

  • Die Bond Development Engineer Ambition Malaysia Jan 25, 2025

    \ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Sr Equipment Engineer Dexcom Pulau Pinang Jan 24, 2025

    Job Description: About Dexcom Founded in 1999, Dexcom, Inc. (NASDAQ: DXCM), develops and markets Continuous Glucose Monitoring (CGM) systems for ambulatory use…

  • Die Bond Equipment Engineer Ambition Malaysia Jan 23, 2025

    \ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…

  • \ Status POSITION : Senior Electrical Engineer REPORTING TO : Head of Maintenance Engineering and Reliability DIVISION/DEPARTMENT : PBF/M LOCATION : KL…

  • Powering Positive Change In a world of constant change, the only way to make a meaningful impact is to stay ahead of…

  • Die Bond Development Engineer Ambition Malaysia Jan 20, 2025

    \ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Rotating Equipment Engineer Shell Miri, Sarawak Jan 19, 2025

    Sarawak, MalaysiaJob Family Group: Discipline EngineeringWorker Type: RegularPosting Start Date:Business unit: Integrated Gas and UpstreamExperience Level: Experienced ProfessionalsJob Description:If you are an…

  • Lattice Overview Lattice Semiconductor (NASDAQ: LSCC) is the global leader in smart connectivity solutions, providing market leading intellectual property and low power,…

  • Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…

  • Powering Positive Change In a world of constant change, the only way to make a meaningful impact is to stay ahead of…

  • Lattice Overview Lattice is the source for innovative FPGA, PLD, and programmable Power Management solutions. We design and develop programmable logic solutions,…

  • MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…

  • Die Bond Equipment Engineer Ambition Malaysia Jan 08, 2025

    \ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…

  • Die Bond Equipment Engineer Ambition Malaysia Jan 01, 2025

    \ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…