MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276832_1732265868Wire Bond Development EngineerJob descriptionOur client is a semiconductor MNC in…
\ \ CM03400 Senior/ Staff Process Development Engineer (Mold Development)Job Specialization: Engineering Mechanical/AutomotiveWorking Location: JohorSalary Range: Max 10,000Posted Date: 21/03/2024Location: JohorClient\\\'s Profile:…
\ Location: Melaka Job ID: HRC0328811 Workplace type: On site Job description In your new role you will: Accountable for process quality…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
\ Job Description In your new role you will: Establish and/or modify planned maintenance guide to ensure all equipment have reliable machine…
\ \ Job Description In your new role you will: Responsible for self contain improvement in responsible package line Ensure KPIs are…
\ Location: Melaka, Melaka Job ID: HRC0421210 Job description In your new role you will: Establish and/or modify planned maintenance guide to…
\ Job Description In your new role you will: Responsible for process quality on equipment/process level Responsible for self contain improvement in…
\ General Overview Functional Area: Engineering Career Stream: Process Engineering Manufacturing SAP Short Name: LEN ENG PRM Job Level: Level 08 IC/MGR:…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Location: Kulim Job ID: HRC0251765 Job description In your new role you will: Drive the development of GaN power technologies…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ Your Contribution Development Develops process and production concepts for improvement of existing processes, implementation of new processes or new products. Concepts…
\ Your Contribution Develops process and production concepts for improvement of existing processes, implementation of new processes or new products. Prepares requirement…
\ Location: Melaka Job ID: HRC0364310 Job description In your new role you will: Responsible for process quality on equipment/process level Responsible…
\ \ Process Development Staff/Senior Staff Engineer (PVD/ALD/Anneal)\ Kulim, Malaysia \\xe2\\x80\\x93 OSRAM OS Penang\ \ \ What we expect\ \ \ Develop…
\ Req ID: 118926 Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim General Overview Functional Area: Engineering Career Stream:…