\ \ Job Description In your new role you will: To sustain, improve the process in order to deliver products to customers…
Responsible for organization\'s manufacturing assembly processes (wire bond), define product assembly procedures and FMEA. Initiate, direct, and coordinate through the efforts of…
\ \ Location: Melaka, Melaka Job ID: HRC0519773 Workplace type: On siteJob description In your new role you will: To sustain, improve…
Come join Analog Devices (ADI) a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new…
\ Career Opportunities Quality Engineer Job Summary: Ensure product conformance to the Quality requirement of the company and customers. Job Responsible: Determine…
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought…
Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting edge packaging technologies for…
Seeking a highly motivated and experienced Advanced Packaging Process Engineer to drive the development and optimization of cutting edge packaging technologies for…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Good discipline and behavior, willing to learn and grow. Shift technician support production to achieve…