\ \ MalaysiaJob details Posted 17 September 2024 SalaryRM10000 RM15000 per month LocationMalaysia Job type Discipline Reference252045_1726550199Wire Bond Principal Process EngineerJob descriptionOur…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273052_1717945453Sr Process Engineering Manager (Wire Bond)Job descriptionOur client is…
\ \ MalaysiaJob details Posted 09 June 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1717945401Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276832_1732265868Wire Bond Development EngineerJob descriptionOur client is a semiconductor MNC in…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference266336_1687167202 Process Development Manager, Die Bond Job description This…
\ \ MalaysiaJob details Posted 19 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1716051585Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference273443_1721349295Wire Bond Process Development ManagerJob descriptionOur client is a…
\ \ MalaysiaJob details Posted 19 July 2024 SalaryRM15000 RM21000 per month LocationMalaysia Job type Discipline Reference273052_1721349840Sr Process Engineering Manager (Wire Bond)Job…
\ \ Location: Melaka Job ID: HRC0169097 Job description In your new role you will: Sustains and continuously improves qualified technologies in…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference271238_1729681599Wire Bond Process EngineerJob descriptionThis rapidly expanding global semiconductor…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ Location: Melaka Job ID: HRC0338347 Job description In your new role you will: Sustains and continuously improves qualified technologies in volume…
\ Job Description In your new role you will: Sustains and continuously improves qualified technologies in volume production with regards to stability,…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference252045_1723969380Wire Bond EngineerJob descriptionOur client is a multinational semiconductor…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ Location: Melaka Job ID: HRC0752317Job description In your new role you will: Wire Bond expert, responsible to achieve robust and…
\ \ Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto pilot processes Sustains…