\ Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Good discipline and behavior, willing to learn and grow. Shift technician support production to achieve…
\ \ #Quality Assurance #Quality Control #SolidWorks #AutoCAD #Robotics #PLC Programming #Quality Management Systems #Lean Manufacturing #Six SigmaSalary Package: RM6000 RM10,000 Commensurate…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ #Quality Assurance #Quality Control #SolidWorks #AutoCAD #Robotics #PLC Programming #Quality Management Systems #Lean Manufacturing #Six SigmaSalary Package: RM6000 RM10,000 Commensurate…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1732267956Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ \ #Quality Assurance #Quality Control #SolidWorks #AutoCAD #Robotics #PLC Programming #Quality Management Systems #Lean Manufacturing #Six SigmaSalary Package: RM6000 RM10,000 Commensurate…
\ #Quality Assurance #Quality Control #SolidWorks #AutoCAD #Robotics #PLC Programming #Quality Management Systems #Lean Manufacturing #Six Sigma Salary Package: RM6000 RM9000 Job…
\ #Quality Assurance #Quality Control #SolidWorks #AutoCAD #Robotics #PLC Programming #Quality Management Systems #Lean Manufacturing #Six Sigma Salary Package: RM6000 RM10,000 Commensurate…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Malaysia Job details Posted 12 September 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1694500453 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 18 January 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1705541484 Die Bond Equipment Engineer Job description This rapidly…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryNegotiable\ \ \ LocationSelangor\ \ \ Job type Permanent…
\ \ MalaysiaJob details Posted 13 May 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1715569407Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Die Bond Development Engineer who specializes in Soft…
\ \ #Quality Assurance #Quality Control #SolidWorks #AutoCAD #Robotics #PLC Programming #Quality Management Systems #Lean Manufacturing #Six SigmaSalary Package: RM6000 RM10,000 Commensurate…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…