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JOB VACANCIES Position : Die Bond Techinician Salary : RM 2000 up to 3500 Status : Permanent Provide : Medical, Kwsp, Socso,…
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JOB VACANCIES Position : Die Bond Techinician Salary : RM 2000 up to 3500 Status : Permanent Provide : Medical, Kwsp, Socso,…
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JOB VACANCIES Position : Die Bond Techinician Salary : RM 2000 up to 3500 Status : Permanent Provide : Medical, Kwsp, Socso,…
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As a Senior Equipment Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Apr 01, 2026About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage…
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Senior/Staff Wire Bond Equipment & Process Engineer Nexperia Germany GmbH Seremban, M05, MY Mar 31, 2026
About the Role We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role,…
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As a Senior Equipment Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in…
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Job Description Job Summary Develop, optimize and implement robust wire bonding processes for new semiconductor product. This includes developing process parameters, troubleshooting…
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Die Bond / Wire Bond Process Development Senior Staff Engineer ams OSRAM Bayan Lepas, M07, MY Mar 23, 2026The ams OSRAM Opto Semiconductors business offers high performance opto semiconductor components and in depth support for state of the art system…
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Die Bond / Wire Bond Process Development Senior Staff Engineer ams OSRAM Bayan Lepas, M07, MY Mar 20, 2026
Die Bond / Wire Bond Process Development Senior Staff Engineer Bayan Lepas, Penang, Malaysia - OSRAM OS Penang What we expect Develop…
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Job DescriptionParticipate in wire bond equipment performance improvement projects (OEE). Assist engineers in monitoring machine performance, capacity analysis, and improvement activities. Support…
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Job Description Work on wire bond equipment performance (OEE) improvement project. Support engineer in machine performance, capacity analysis and execution of improvement…
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Position : Die Bond Techinician Location : Ampang KL. Salary : up to 3800++ Status : Permanent Provide : Medical, Kwsp, Socso,…
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Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line) Nexperia Germany GmbH Seremban, M05, MY Mar 17, 2026
About the role This role is responsible for end to end ownership of both process and equipment performance for Die Bond and…
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About the Role: We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role,…
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About the role We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this…
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About the Role The Molding Equipment Engineer is responsible for leading the maintenance, optimization, and continuous improvement of molding equipment performance across…
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As a Senior Equipment Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in…
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