\ Role Purpose You will utilize discipline knowledge and design experience as it relates to compressors, pumps, gas turbines, engines, and ancillary…
\ Role Purpose You are responsible for using discipline knowledge and design experience related to static equipment, utilities equipment, lifting & handling…
CM03618 SMT Equipment Engineer Job Specialization: Engineering Others Working Location: Johor Salary Range: Negotiable Posted Date: 24/08/2023 Location: Johor Client\'s Profile: Multi…
Flex, a Fortune global 500 company, is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver…
Sarawak, Malaysia Job Family Group: Discipline Engineering Worker Type: Regular (FTC) (Fixed Term) Posting Start Date: Business unit: Projects and Technology Experience…
\ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This…
Da Vinci Assembly Equipment Engineer \\xc2\\xb7 Evaluate and recommends equipment improvements to improve availability, capability and yield. \\xc2\\xb7 Perform equipment analyses (including…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ Job description Da Vinci Assembly Equipment Engineer . Evaluate and recommends equipment improvements to improve availability, capability and yield. . Perform…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Kulim, MY Mar 5, 2024 16444 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ Kulim, MY Nov 28, 2023 16203 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
\ Malaysia Job details Posted 04 November 2023 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1699091036 Die Bond Equipment Engineer Job description This rapidly…