\ Malaysia Job details Posted 04 November 2023 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1699091116 Die Bond Process Engineer Job…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference276867_1732265553Test Equipment EngineerJob descriptionOur client in the central region of Malaysia…
Sarawak, Malaysia Job Family Group: Discipline Engineering Worker Type: Regular (FTC) (Fixed Term) Posting Start Date: Business unit: Projects and Technology Experience…
\ \ MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This…
\ \ Job Purpose: This position manage the rotating engineering group and is a leading member of the Engineering Team in SapuraOMV…
\ \ MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference269972_1723969255Test Equipment EngineerJob descriptionThis rapidly expanding semiconductor company in…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Job Description You will utilize discipline knowledge and design experience as it relates to compressors, pumps, gas turbines, engines, and ancillary…
Sarawak, MalaysiaJob Family Group: Discipline EngineeringWorker Type: RegularPosting Start Date:Business unit: Integrated Gas and UpstreamExperience Level: Experienced ProfessionalsJob Description:If you are an…
Job Description: Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Kulim, MY Mar 5, 2024 16444 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ Kulim, MY Nov 28, 2023 16203 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ \ MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company…