-
-
Sarawak, Malaysia Job Family Group: Discipline Engineering Worker Type: Regular Posting Start Date: July 14, 2025 Business unit: Integrated Gas and Upstream…
-
Contexte et environnement Are you an expert in rotating equipment with a passion for reliability, safety, and performance in offshore operations? We…
-
Mindpec Solutions Hiring! Full Time Wire Bond Staff Engineer in Melaka, Earn up to MYR 10,000 Ricebowle.target.src = \'https://files.ajobthing.com/assets/premium job/premium default banner.png\'"…
-
Come join Analog Devices (ADI) - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing…
-
Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1708338802 Die Bond Equipment Engineer Job description This rapidly expanding…
-
MalaysiaJob details Posted 23 October 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1729681505Die Bond Process EngineerJob descriptionThis leading semiconductor company…
-
Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This electronics…
-
Sarawak, MalaysiaJob Family Group: Discipline EngineeringWorker Type: RegularPosting Start Date:Business unit: Integrated Gas and UpstreamExperience Level: Experienced ProfessionalsJob Description:If you are an…
-
Sarawak, Malaysia Job Family Group: Discipline Engineering Worker Type: Regular (FTC) (Fixed Term) Posting Start Date: Business unit: Projects and Technology Experience…
-
MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference269972_1723969255Test Equipment EngineerJob descriptionThis rapidly expanding semiconductor company in Malacca is…
-
-
MalaysiaJob details Posted 19 October 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1729267723Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
-
MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1723969269Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
-
MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
-
MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
-
MalaysiaJob details Posted 23 September 2024 SalaryRM5000 RM8000 per annum LocationMalaysia Job type Discipline Reference268089_1727104846Die Bond Process EngineerJob descriptionThis leading semiconductor company…
-
MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268768_1726550432Die Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
-
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
-
Job Description: Be part of the solution at Technip Energies and embark on a one of a kind journey. You will be…
-
MalaysiaJob details Posted 21 July 2024 SalaryNegotiable LocationMalaysia Job type Discipline Reference268136_1721495419Die Bond Equipment EngineerJob descriptionThis rapidly expanding semiconductor company in Melaka…
-
Kulim, MY Mar 5, 2024 16444 Be part of our team! AT&S, a world leading high tech PCB & IC substrates company…
-