\ \ HP is the world\\\'s leading personal systems and printing company, we create technology that makes life better for everyone, everywhere.…
\ \ Flex is the diversified manufacturing partner of choice that helps market leading brands design, build and deliver innovative products that…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryNegotiable\ \ \ LocationMalaysia\ \ \ Job type Permanent…
\ \ Kulim, MY Apr 30, 2024 16594 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ \ \\xef\\xbb\\xbfClient Background: MNC CompanyIndustry : Steel Fabricator ManufacturingLocation: Iskandar Puteri, JBHeadcount: 1Position Title: Process Engineer (Stamping)Tenure: PermanentRemuneration: RM 3,000 RM…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ \\xef\\xbb\\xbfClient Background: MNC CompanyIndustry : Steel Fabricator ManufacturingLocation: Iskandar Puteri, JBHeadcount: 1Position Title: Process Engineer (Stamping)Tenure: PermanentRemuneration: RM 3,000 RM…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Kulim, MY Feb 27, 2024 16349 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Kulim, MY Jan 17, 2024 16349 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference266336_1687167202 Process Development Manager, Die Bond Job description This…
\ \ As a Process Engineer, you will conduct investigation and recommend suitable adjustment for WIP batch which having properties non conformance…