\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1723969287Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ Flex, a Fortune global 500 company, is the diversified manufacturing partner of choice that helps market leading brands design, build and…
\ \ MalaysiaJob details Posted 18 August 2024 SalaryNegotiable LocationMalacca Job type Discipline Reference270201_1723969165Wire Bond Process ManagerJob descriptionThis rapidly expanding Semiconductor company…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
MalaysiaJob details Posted 05 December 2024 SalaryRM7000 RM9500 per month LocationMalaysia Job type Discipline Reference278126_1733342773Sr Process Engineer (Wire Bond, Die Bond)Job descriptionOur…
\ \ MalaysiaJob details Posted 17 September 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1726550364Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company…
\ \ Kulim, MY Feb 27, 2024 16349 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ Kulim, MY Jan 17, 2024 16349 Be part of our team! AT&S, a world leading high tech PCB & IC Substrates…
Our client is a Multinational Semiconductor company in Penang. They are seeking a Sr FOL Process Engineer with exposure to Wire Bond…
\ Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what…
\ Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you…
MalaysiaJob details Posted 22 November 2024 SalaryNegotiable LocationSelangor Job type Discipline Reference268765_1732267987Wire Bond Development EngineerJob descriptionThis rapidly expanding semiconductor company in Selangor…
\ Malaysia Job details Posted 19 June 2023 SalaryNegotiable LocationMalacca Job type Discipline Reference266336_1687167202 Process Development Manager, Die Bond Job description This…
\ \ As a Process Engineer, you will conduct investigation and recommend suitable adjustment for WIP batch which having properties non conformance…
\ \ Job details\ \ \ \ Posted 04 November 2023\ \ \ SalaryNegotiable\ \ \ LocationMalaysia\ \ \ Job type Permanent…
\ \ Kulim, MY Apr 30, 2024 16594 Be part of our team! AT&S, a world leading high tech PCB & IC…
\ \ \\xef\\xbb\\xbfClient Background: MNC CompanyIndustry : Steel Fabricator ManufacturingLocation: Iskandar Puteri, JBHeadcount: 1Position Title: Process Engineer (Stamping)Tenure: PermanentRemuneration: RM 3,000 RM…
\ \ Job Description This rapidly expanding semiconductor company in Selangor is seeking a Wire Bond Development Engineer. Key Responsibilities Research and…
\ \ \\xef\\xbb\\xbfClient Background: MNC CompanyIndustry : Steel Fabricator ManufacturingLocation: Iskandar Puteri, JBHeadcount: 1Position Title: Process Engineer (Stamping)Tenure: PermanentRemuneration: RM 3,000 RM…
\ Malaysia Job details Posted 19 February 2024 SalaryNegotiable LocationJohor Job type Discipline Reference269581_1708338581 Staff Process Engineer, Die Bond Job description This…